Ho sebelisa theknoloji ea optoelectronic co-packaging ho rarolla phetiso e kholo ea data Karolo ea pele

Ho sebelisaoptoelectronictheknoloji ea ho paka hammoho ho rarolla phetiso e kholo ea data

E tsamaisoa ke nts'etsopele ea matla a k'homphieutha ho ea boemong bo phahameng, palo ea data e ntse e eketseha ka potlako, haholo-holo sephethephethe se secha sa khoebo sa setsi sa data se kang AI mehlala e meholo le thuto ea mochine e khothalletsa kholo ea data ho tloha qetellong ho ea qetellong le ho basebelisi. Lintlha tse kholo li hloka ho fetisetsoa ka potlako ho li-angles tsohle, 'me sekhahla sa phetisetso ea data se boetse se tsoetse pele ho tloha ho 100GbE ho ea ho 400GbE, kapa esita le 800GbE, ho bapisa matla a k'homphieutha a ntseng a eketseha le litlhoko tsa ho sebelisana ha data. Ha litekanyetso tsa mela li ntse li eketseha, ho rarahana ha boemo ba boto ea hardware e amanang le eona ho eketsehile haholo, 'me I / O ea setso e hlōlehile ho sebetsana ka katleho le litlhoko tse sa tšoaneng tsa ho fetisetsa lipontšo tsa lebelo le phahameng ho tloha ho ASics ho ea pele. Boemong bona, ho batloa liphutheloana tsa CPO optoelectronic.

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Tlhokahalo ea ts'ebetso ea data e eketseha, CPOoptoelectronicco-tiiso hloko

Sistimi ea puisano ea optical, module ea optical le AISC (Network switching chip) li phuthetsoe ka thoko, 'meoptical modulee hoketsoe phanele e ka pele ea switjha ka mokhoa o ka khonang. Mokhoa oa ho plugable ha o o tloaelehe, 'me likhokahano tse ngata tsa setso tsa I/O li hokahantsoe hammoho ka mokhoa oa plugable. Le hoja pluggable e ntse e le khetho ea pele tseleng ea tekheniki, mokhoa oa plugable o pepesitse mathata a mang ka litefiso tse phahameng tsa data, 'me bolelele ba khokahano lipakeng tsa sesebelisoa sa optical le boto ea potoloho, tahlehelo ea phetisetso ea mats'oao, tšebeliso ea matla, le boleng bo tla thibeloa joalo ka ha. lebelo la ts'ebetso ea data le hloka keketseho e eketsehileng.

E le ho rarolla litšitiso tsa khokahanyo ea setso, CPO optoelectronic co-packaging e se e qalile ho fumana tlhokomelo. Ho Co-packaged optics, li-optical modules le AISC (Network switching chips) li phuthetsoe hammoho 'me li hokahanngoa ka likhokahano tsa motlakase tsa sebaka se sekhutšoane, ka hona ho fihlela kopano ea compact optoelectronic. Melemo ea boholo le boima ba 'mele bo tlisoang ke CPO photoelectric co-packaging e totobetse,' me miniaturization le miniaturization ea li-high-speed optical modules lia phethahala. Optical module le AISC (Network switching chip) li na le bohareng ba boto, 'me bolelele ba fiber bo ka fokotsoa haholo, ho bolelang hore tahlehelo nakong ea phetisetso e ka fokotseha.

Ho latela lintlha tsa liteko tsa Ayar Labs, CPO opto-co-packaging e ka fokotsa ka ho toba tšebeliso ea matla ka halofo ha e bapisoa le li-module tsa optical plugable. Ho ea ka lipalo tsa Broadcom, ho 400G pluggable optical module, morero oa CPO o ka boloka hoo e ka bang 50% ho sebelisoa matla, 'me ha o bapisoa le 1600G pluggable optical module, morero oa CPO o ka boloka matla a mangata a sebelisoang. Sebopeho se bohareng haholo se boetse se etsa hore sekhahla sa khokahanyo e eketsehe haholo, tieho le ho khopama ha lets'oao la motlakase li tla ntlafatsoa, ​​'me thibelo ea lebelo la phetisetso ha e sa tšoana le mokhoa o tloaelehileng oa pluggable.

Ntlha e 'ngoe ke litšenyehelo, bohlale ba maiketsetso ba kajeno, seva le litsamaiso tsa switjha li hloka sekhahla se phahameng ka ho fetesisa le lebelo, tlhoko ea hajoale e ntse e eketseha ka potlako, ntle le ts'ebeliso ea liphutheloana tsa CPO, tlhokahalo ea palo e kholo ea lihokelo tse phahameng tsa ho hokahanya. optical module, e leng litšenyehelo tse kholo. CPO co-packaging e ka fokotsa palo ea li-connectors hape ke karolo e kholo ea ho fokotsa BOM. CPO photoelectric co-packaging ke eona feela tsela ea ho fihlella lebelo le phahameng, bandwidth e phahameng le marang-rang a matla a tlase. Theknoloji ena ea ambalaji silicon likarolo photoelectric le likarolo tsa elektronike hammoho etsa hore mmojule optical haufi kamoo ho ka khonehang ho netweke switjha Chip ho fokotsa tahlehelo kanaleng le impedance discontinuity, haholo ntlafatsa segokanyipalo segokanyipalo le ho fana ka tšehetso botekgeniki bakeng sa sekgahla phahameng mabapi ya data nakong e tlang.


Nako ea poso: Apr-01-2024