Evolution le tsoelopele ea CPOoptoelectronictheknoloji ea ho paka hammoho
Optoelectronic co-packaging ha se thekenoloji e ncha, nts'etsopele ea eona e ka qalisoa ho tloha lilemong tsa bo-1960, empa ka nako ena, ho paka ka photoelectric ke sephutheloana se bonolo feela sa.lisebelisoa tsa optoelectronicmmoho. Ka bo-1990, ka ho phahama haoptical communication moduleindasteri, photoelectric copackaging e ile ea qala ho hlaha. Ka ho phatloha ha matla a phahameng a k'homphieutha le tlhokahalo e phahameng ea bandwidth selemong sena, photoelectric co-packaging, le theknoloji e amanang le eona ea lekala, e boetse e fumane tlhokomelo e ngata.
Ho nts'etsopele ea thekenoloji, mohato ka mong o boetse o na le mefuta e fapaneng, ho tloha ho 2.5D CPO e lumellanang le 20/50Tb / s tlhokahalo, ho ea ho 2.5D Chiplet CPO e lumellanang le 50 / 100Tb / s tlhokahalo, 'me qetellong e hlokomela 3D CPO e lumellanang le 100Tb / s. sekhahla.
Liphutheloana tsa 2.5D CPO tsaoptical modulele netweke switjha Chip ka substrate tšoanang ho khutsufatsa mola sebaka le ho eketsa segokanyipalo sa I / O, 'me 3D CPO ka ho toba amahanya le optical IC lera mokena-lipakeng ho finyella interconnection ea I / O sekontiri se metsi ka tlase ho 50um. Sepheo sa ho iphetola ha sona se hlakile haholo, e leng ho fokotsa sebaka se pakeng tsa mochine oa ho fetola photoelectric le mochine oa ho fetola marang-rang ka hohle kamoo ho ka khonehang.
Hona joale, CPO e sa ntsane e le teng, 'me ho ntse ho e-na le mathata a kang lihlahisoa tse tlaase le litšenyehelo tse phahameng tsa tlhokomelo,' me bahlahisi ba fokolang 'marakeng ba ka fana ka lihlahisoa tse amanang le CPO ka botlalo. Ke Broadcom feela, Marvell, Intel, le libapali tse ling tse 'maloa tse nang le tharollo e felletseng' marakeng.
Marvell o hlahisitse switch ea theknoloji ea 2.5D CPO e sebelisa ts'ebetso ea VIA-LAST selemong se fetileng. Ka mor'a hore silicon optical chip e sebetsanoe, TSV e sebetsoa ka matla a ho sebetsa a OSAT, 'me joale chip flip-chip ea motlakase e kenngoa ho silicon optical chip. Li-module tse 16 tsa optical le switching chip Marvell Teralynx7 li hokahane ho PCB ho etsa switch, e ka fihlelang sekhahla sa ho fetoha sa 12.8Tbps.
Ho OFC ea selemo sena, Broadcom le Marvell le bona ba bonts'itse moloko oa morao-rao oa 51.2Tbps switch chips o sebelisa theknoloji ea optoelectronic co-packaging.
Ho tloha molokong oa morao-rao oa Broadcom oa lintlha tsa tekheniki tsa CPO, sephutheloana sa CPO 3D ka ntlafatso ea ts'ebetso ea ho finyella boima bo phahameng ba I / O, tšebeliso ea matla ea CPO ho 5.5W / 800G, karolelano ea matla a matla ke ts'ebetso e ntle haholo e ntle haholo. Ka nako e ts'oanang, Broadcom e boetse e phunyeletsa leqhubu le le leng la 200Gbps le 102.4T CPO.
Cisco e boetse e ekelitse matsete a eona ho theknoloji ea CPO, mme e entse pontšo ea sehlahisoa sa CPO ho OFC ea selemo sena, e bonts'a pokello ea eona ea theknoloji ea CPO le ts'ebeliso ho multiplexer/demultiplexer e kopantsoeng haholoanyane. Cisco e re e tla tsamaisa ts'ebetso ea sefofane ea CPO ho li-switches tsa 51.2Tb, e lateloe ke kamohelo e kholo ea li-switch cycles tsa 102.4Tb.
Intel esale e hlahisa li-switch tse thehiloeng ho CPO, 'me lilemong tsa morao tjena Intel e ntse e tsoela pele ho sebetsa le Ayar Labs ho lekola litharollo tsa khokahano ea mats'oao a holimo a bandwidth, a bula tsela bakeng sa tlhahiso e kholo ea lisebelisoa tsa optoelectronic co-packaging le optical interconnect.
Le hoja li-module tsa plugable e ntse e le khetho ea pele, ntlafatso e akaretsang ea matla ao CPO e ka e tlisang e hohetse bahlahisi ba bangata. Ho ea ka LightCounting, thepa ea CPO e tla qala ho eketseha haholo ho tloha 800G le 1.6T likoung, butle-butle e qala ho fumaneha khoebong ho tloha 2024 ho ea 2025, 'me e thehe palo e kholo ho tloha 2026 ho ea 2027. Ka nako e ts'oanang, CIR e lebeletse hore Chelete ea 'maraka ea liphutheloana tsa photoelectric e tla fihla ho $5.4 bilione ka 2027.
Pejana selemong sena, TSMC e phatlalalitse hore e tla kopanya matsoho le Broadcom, Nvidia le bareki ba bang ba kholo ho nts'etsapele theknoloji ea silicon photonics, lisebelisoa tse tloaelehileng tsa optical CPO le lihlahisoa tse ling tse ncha, theknoloji ea ts'ebetso ho tloha 45nm ho isa ho 7nm, mme e boletse hore halofo ea bobeli e potlakile ka ho fetesisa. ea selemo se tlang o ile a qala ho kopana le odara e kholo, 2025 kapa ho feta ho fihlela bophahamo ba modumo.
E le tšimo ea theknoloji e fapaneng e kenyelletsang lisebelisoa tsa photonic, lipotoloho tse kopantsoeng, ho paka, ho etsa mohlala le ho etsisa, theknoloji ea CPO e bonahatsa liphetoho tse tlisoang ke optoelectronic fusion, 'me liphetoho tse tlisoang ke phetiso ea data ha ho pelaelo hore li senya. Le hoja ts'ebeliso ea CPO e ka bonoa feela litsing tse kholo tsa data ka nako e telele, ka ho atolosoa ho eketsehileng ha matla a maholo a k'homphieutha le litlhoko tse phahameng tsa bandwidth, theknoloji ea CPO photoelectric co-seal e fetohile lebala le lecha la ntoa.
Ho ka bonoa hore bahlahisi ba sebetsang ho CPO ka kakaretso ba lumela hore 2025 e tla ba node ea bohlokoa, eo hape e leng node e nang le phapanyetsano ea 102.4Tbps, 'me bofokoli ba li-module tsa pluggable li tla matlafatsoa ka ho eketsehileng. Le hoja likopo tsa CPO li ka tla butle, ha ho pelaelo hore opto-electronic co-packaging ke eona feela tsela ea ho finyella lebelo le phahameng, li-bandwidth tse phahameng le marang-rang a matla a tlaase.
Nako ea poso: Apr-02-2024